1. epoxy sealant (EMC)
Electronic components in electronic and electrical products are usually encapsulated with epoxy sealant (EMC), and packing components such as silica fume can make epoxy sealant cost-effective.The powder materials of NOVOPOWDER's series of crystalline and fused silica micropowders can be used as excellent fillers for general use.
Spherical silica powder is widely used in the packaging of high-end semiconductor devices due to its characteristics of high filling, high flow, low wear and low stress.In particular, spherical silica powder with precise control of coarse particles can also be used as fillers for epoxy plastic sealants in narrow gap packages, fillers for liquid encapsulated resins such as Underfiller and Globe top, and fillers for various resin Substrate.
In addition, with the miniaturization and higher integration of electronic products, thermal management of electronic products is becoming more and more important.Rounded crystalline silicon powder and spherical alumina can provide excellent thermal conductivity for fully encapsulated and high thermal conductivity epoxy plastics.
2.Copper clad plate (CCL)
Copper clad plate (CCL) is often used as the substrate for printing circuit board in electronic and electrical products, and the addition of ultra-fine silica powder as filler can improve the CTE, heat resistance and reliability of copper clad plate.
The NOVOPOWDER ultrafine crystalline silicon micropowder and soft composite silicon micropowder of lianrui are universal copper clad sheet filler.The fused silica powder can be used as Low Dk copper clad sheet filler.
Spherical silica powder can be used as high filler to provide excellent performance for Low Dk copper clad plate and IC carrier plate.Spherical alumina products can be used as an ideal filler for aluminum substrate and copper clad plate with high thermal conductivity.
3. Ink for printed circuit board
PCB ink is a necessary protective material for PCB.The NOVOPOWDER ultrafine crystalline silicon powder can provide ideal scratch resistance, low thermal expansion coefficient, chemical resistance and long-term reliability for the circuit board.
4. Epoxy coating material
Capacitors, resistors and other components in electronic and electrical products are encapsulated with epoxy encapsulating materials.The NOVOPOWDER fused silica powder is a common component of epoxy encapsulating material.
5. Electronic sealant
Power supply and other components in electronic and electrical products are usually sealed with epoxy or silicone sealant.NOVOPOWDER crystalline powder, fused silica powder and spherical silica powder of lianrui can be selected as filling sealant according to thermal expansion coefficient, thermal conductivity, viscosity, cost and other considerations.Spherical alumina is used to seal power devices due to its high filling and cost-effective thermal conductivity.
6. Thermal interface materials (TIM)
Miniaturization of electronics makes thermal management necessary.Thermal interface materials (TIM) can fill the air gap caused by uneven contact surface of electronic components, thus improving the heat dissipation capacity.Heat conducting gasket or heat conducting silicone grease are common heat interface materials, while crystalline silicon micropowder, spherical aluminum oxide powder and other high heat conducting fillers are important components of heat conducting gasket or heat conducting silicone grease.
----------Weifang Guote Mining Equipment Company
